SPUTTERING

The DTF Technology GmbH offers the sputtering technology as one of several other available technologies for the deposition of layers/coatings in the field of thin film deposition. To the sputtering application range pertains among others the photovoltaics, solar thermic (application), the semiconductor and micro electronics, the data storage technology, applied optics and the jewelry finishing.

Sputtering, also called cathodic sputtering, is a PVD (physical vapor deposition) technique. The advantage compared to CVD (chemical vapor deposition) is the lowered deposition temperature and therefore the lowered thermal stress of the substrate.

DTF Technology GmbH designs, manufactures and starts up sputtering equipments based on customer tailored specifications for the different sputtering techniques like DC, RF and MF (reactive) sputtering. With these techniques it can be deposited electrically conducting layers as well as insulating and non conducting layers.

These sputtering technologies can be integrated into inline, cluster and also role-to-role equipment.