HANDLING SYSTEMS
FOR VACUUM EQUIPMENT

Automatic wafer handling system for high energy ion implantation. Using cassette handling, wafer sizes from 2” to 8” can be handled. The modular design allows highest flexibility.

Features of DTF-UVHS-200C vacuum handling system:

• customized system design, adapted to high energy ion implantation system
• 2 (optional 3) load lock chambers (each with elevator system)
• 3-axis wafer handler
• high flexibility due to cassette handling for various types / shapes of substrates, 20 cassettes in one box
• suitable for R&D and for small scale production
• unique combination of electrostatic and mechanical ion beam scanning (rotatable substrate holder with additional z-drive for optimized uniformity)
• 4 channel beam current measurement system using adjustable Faraday corner cups
• substrate tilt standard 0° or 7° full range between 0-90° possible